Research on chemical modification of nickel coating on diamond particles surface
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摘要: 为消除金刚线生产过程中分散剂对工艺的负面影响，探索新的金刚线镀镍工艺。首先，使用H2O2对镀镍金刚石颗粒表面进行羟基化；然后，将其同二甲基十八烷基[3-（三甲氧基硅）丙基]氯化铵进行反应，制备表面带正电的金刚石颗粒；最后，对金刚线的制备工艺进行优化。研究结果表明：反应后金刚石颗粒的表面电位从−7.50 mV转变至14.10 mV以上，最高可达30.68 mV。其最佳制备条件为原砂与H2O2的质量比为2∶1，处理时间为1 h；金刚石颗粒与季铵盐的质量比为1∶2，处理时间为4 h。在电镀过程中，经表面化学修饰的金刚石颗粒能够在没有分散剂的条件下，均匀地向阴极迁移，其上砂量增多20%以上。Abstract: A new nickel plating process for diamond wire is explored to eliminate the negative impact of dispersants on the production process of diamond wires. The surface of of Ni-plated diamond particles was first hydroxylated with hydrogen peroxide, and then reacted with dimethyloctadecyl [3-trimethoxysilylpropyl] ammonium chloride to prepare positively charged diamond particles. Finally, the preparing process of diamond wires were optimized. Results show that the surface potential of diamond particles increases from −7.50 mV to 14.10 mV or above after reaction, up to 30.68 mV. The best preparing conditions are as follows: The mass ratio of raw sand to hydrogen peroxide is 2 to 1, with treating time of 1 h; The mass ratio of diamond particles to quaternary ammonium salts is 1 to 2, with treating time of 4 h. In the electroplating process, the diamond particles with chemically modified surface would uniformly migrate towards the cathode without dispersants, the sanding capacity of which could be increased by 20% or more.
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Key words:
- diamond wire /
- nickel coating /
- chemical modification /
- electroplating
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图 3 金刚石颗粒的扫描电镜与对应的元素分析图谱
(a) 原料的SEM图谱及C、O、Ni元素分布；(b) 处理后样品的SEM图谱及C、O、Ni元素分布
Figure 3. SEM and corresponding EDS of diamond particles
(a) SEM of raw diamond and distribution of C, O, and Ni; (b) SEM of treated diamond and distribution of C, O, and Ni
图 4 镀镍表面引入季铵盐后的红外光谱
Figure 4. Infrared spectra of nickel-plated surface after introducing quaternary ammonium salts
图 5 不同条件下制备的金刚石颗粒的上砂情况
Figure 5. Sanding of diamond particles prepared under different conditions
表 1 H2O2处理前后镀镍金刚石颗粒表面元素分布
Table 1. Element distribution on surfaces of Ni-plated diamonds before / after H2O2 treatment
样品 元素 物质的量分数 n / % 质量分数 w / % 原料 O 2.92 0.81 Ni 97.08 99.19 处理后 O 3.37 0.94 Ni 96.63 99.06 
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表 2 镀镍金刚石粒子表面化学修饰条件优化及对应Zeta电位
Table 2. Surface chemical modification conditions and corresponding Zeta potential of Ni-plated diamond particles
序号 过氧化氢
VOH / mL时间
tOH / h季铵盐
mNH / g时间
tNH / hZeta电位
ζ / mV1 10.0 6 4 8 19.79 2 10.0 3 2 8 14.10 3 10.0 1 2 8 20.05 4 3.0 1 4 8 17.73 5 2.0 1 10 8 20.05 6 1.0 1 2 8 27.17 7 1.0 1 2 4 25.17 8 0.5 1 2 4 30.68 9 0.0 0 1 4 15.80
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表 3 公斤级中试颗粒测试条件
Table 3. Test conditions of kilogram scale pilot scale experiment
样品编号 打片时长
tm / min镀液中颗粒
漂浮情况镀液中颗粒
抱团情况3#点位
对比6#点位
对比11 0.5 无 无抱团 多 多 12 1.0 无 无抱团 多 多 13 2.5 无 无抱团 多 多
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