金刚石基材料及其表面微通道制备技术在高效散热中的应用

邓世博; 夏永琪; 吴明涛; 岳晓斌; 雷大江

doi:10.13394/j.cnki.jgszz.2023.0132

金刚石基材料及其表面微通道制备技术在高效散热中的应用

doi: 10.13394/j.cnki.jgszz.2023.0132

1.
四川省精密超精密加工工程技术研究中心, 成都 610200
2.
南京航空航天大学机电工程学院, 南京 210016
3.
中国工程物理研究院材料研究所, 四川绵阳 621908

基金项目: 国家自然科学基金（52005461）；河南省重大科技专项（221100230300）。

详细信息

作者简介:
邓世博，男，1999年生，硕士研究生。主要研究方向：精密加工及测量。E-mail：1047707038@qq.com

通讯作者:
雷大江，男，1974年生，硕士、研究员。主要研究方向：超精密加工。E-mail：leidajiang@163.com

中图分类号: TG58; TQ164; TB131
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- 文章访问数: 364
- HTML全文浏览量: 103
- PDF下载量: 8
- 被引次数: 0
出版历程
- 收稿日期: 2023-06-21
- 修回日期: 2023-10-08
- 录用日期: 2023-11-03
- 网络出版日期: 2023-11-06
- 刊出日期: 2024-06-28

Application of diamond based materials and surface microchannel fabricationtechnology in efficient heat dissipation

1.
Sichuan Precision and Ultra-Precision Machining Engineering Technology Center, Chengdu 610200, China
2.
College of Mechanical and Electrical Engineering, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China
3.
Institute of Materials, China Academy of Engineering Physics, Mianyang 621908, Sichuan, China

摘要

摘要: 随着第三代半导体材料的兴起，电子器件逐渐向着高功率、小型化、集成化方向发展。传统散热技术已难以满足第三代半导体器件高热流的散热要求，由此带来的温度堆积问题成为器件失效的主要原因。金刚石基材料具有优异的散热性能，基于此材料的高效散热技术有望解决高热流散热难题。总结了金刚石基材料的发展及其表面微通道制备的主要方法，综述了金刚石基材料在高效散热领域中的应用和未来的发展方向。金刚石基材料高效散热技术的发展及应用能够为高热流密度散热难题的解决提供技术支撑。
- 金刚石 /
- 微通道 /
- 加工 /
- 高效散热
Abstract: With the rise of third-generation semiconductors, electronic devices are evolving towards high-power, miniaturization, and integration. Traditional heat dissipation technologies are no longer sufficient to meet the heat dissipation requirements of high heat flux in third-generation semiconductor devices. Temperature accumulation has become a major cause of device failure. Diamond-based materials have excellent thermal properties. Efficient heat dissipation technology based on these materials has become a key direction to solve the high heat flux dissipation problem. This article summarizes the development of diamond-based materials and the main methods for preparing surface microchannels. It reviews the application and development trends of diamond-based materials in the field of efficient heat dissipation. The development and application of diamond-based materials for efficient heat dissipation technology can provide technical support for addressing the problem of high heat flux dissipation.
- diamond /
- microchannel /
- fabrication /
- efficient heat dissipation

HTML全文

图 1 飞秒激光加工出的微通道形貌^[24]

Figure 1. Microchannel morphology fabricated by femtosecond laser processing^[24]

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图 2 紫外纳秒激光加工的金刚石微通道表面与截面形貌^[25]

Figure 2. Surface and cross section morphology of diamond microchannel fabricated by ultraviolet nanosecond laser processing

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图 3 水导激光加工及加工后微结构

Figure 3. Water-assisted laser processing and microstructure after processing

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图 4 具有大深宽比的金刚石光学器件SEM图^[29]

Figure 4. SEM image of diamond gratings with large aspect ratio

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图 5 等离子体蚀刻加工后的微结构阵列

Figure 5. Microstructure array after plasma etching processing

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图 6 铜模板内沉积的三维金刚石膜^[36]

Figure 6. 3D diamond film deposited on copper template

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图 7 模型复制法制得的微结构

Figure 7. Microstructure obtained by model replication technique

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图 8 金刚石微通道及表面亲水处理原理

Figure 8. Diamond microchannel and surface treatment for hydrophily

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图 9 金刚石微通道的转变机理示意^[39]

Figure 9. Schematic diagram of the change mechanism of diamond microchannel

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图 10 铜质多孔表面金刚石微通道制造原理及实物图^[23]

Figure 10. Manufacturing process and physical image of diamond microchannel with copper porous surface^[23]

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图 11 基于金刚石-铜复合材料的扰流柱微通道结构^[41]

Figure 11. Microchannel with pin fin based on diamond-copper composite material^[41]

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图 12 3种不同材料热沉的实物图^[42]

Figure 12. Images of three types of heat sinks of different materials ^[42]

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图 13 LDED增材制造金刚石-铜复合材料微通道示意图^[43]

Figure 13. Schematic diagram of the LDED additive manufacturing for diamond-copper composite microchannel^[43]

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图 14 金刚石热扩散层仿真

Figure 14. Simulation of diamond heat spreader

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图 15 金刚石热扩散层与液冷散热相结合

Figure 15. Combination of diamond heat spreader and liquid cooling heat dissipation

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表 1 常用散热材料的部分性能指标^[12–17]

Table 1. Properties of commonly used heat dissipation materials^[12–17]

材料	热膨胀系数/ (10⁻⁶·K⁻¹)	热导率/ (W·m⁻¹·K⁻¹)	密度/ (g·cm⁻³)	热导率/密度 (λ/ρ)
Al	23.0	230	2.7	85.2
Cu	17.0	400	8.9	44.9
Mo	5.0	140	10.2	13.7
Kovar	5.9	17	8.3	2.0
Invar	1.6	10	8.1	1.2
Diamond	1.0～1.7	800～2 200	3.5	227.3～625.0
Diamond/Al	7.0～9.0	1 021	3.0	340.3
Diamond/Cu	4.0～7.0	900	5.0～6.0	150.0～180.0

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表 2 金刚石材料微通道的研究情况

Table 2. Recent research on the diamond microchannels

材料	散热能力	结论	文献来源
多晶金刚石	1 280 W/cm²热流	金刚石微通道高效散热并有效提高热源温度均匀性	[23]
多晶金刚石	267 W/cm²热流	金刚石能有效扩散热源中心热量	[19]
金刚石	600 W/cm²热流	占空比是影响金刚石微通道传热性能的主要因素	[40]
多晶金刚石	≥1 kW/cm²热流	金刚石微通道在不同热流密度下，存在一个最佳入口质量流量	[22]
多晶金刚石	5 637.10～11 447.20 W/(m²·K)传热系数	金刚石微通道的传热系数较同条件下铝质微通道的提高37%～73%	[21]
多晶金刚石	11 917 W/(m²·K)传热系数	亲水性金刚石微通道传热性能提升20%～50%	[38]
硅 + 金刚石	热点区域1 600 W/cm²热流	热点区域温度均匀性提升41.7%	[20]

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表 3 针对金刚石热扩散层与微通道液冷散热相结合的研究情况

Table 3. Recent research on the combination of diamond heat spreader and microchannel liquid cooling

热沉材料	金刚石厚度/μm	散热能力 kW/cm²	文献来源
SiC	400	热流4～5	[49]
铜	300	热流2.38～11.90	[47]
硅	400	热流～10	[48]
铜	150	稳态热流1 峰值热流30	[50]
铜钼合金	0～20	峰值热流4.3	[44]
铜钼合金	0～14	峰值热流18	[45]
Si/SiC/金刚石	0～10	热流0.86～3.01	[46]

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