Application of Diamond Based Materials in Efficient Heat Dissipation and Surface Microchannel Fabrication Technology
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摘要: 随着第三代半导体的兴起,电子器件正向着高功率、小型化、集成化方向发展,芯片热流密度急剧增加,热量堆积已成为制约器件性能提升的瓶颈问题。金刚石基材料具有优异的热学性能,基于此材料的高效散热技术已成为解决超高热流密度散热难题的关键方向。本文综述了金刚石基材料在高效散热领域中的应用,并论述了金刚石热沉表面微通道加工的主要方法。金刚石基材料高效散热技术的发展及应用,能够为高热流密度散热难题的解决提供技术支撑。
Abstract: With the rise of third-generation semiconductors, electronic devices are developing towards high-power, miniaturization and integration, which causes the heat flux density of chips increasing rapidly. Due to above reasons, heat accumulation has become a critical problem which restricts the improvement of electronic devices performance. Diamond based materials have excellent thermal properties, efficient heat dissipation technology based on these materials has become a key direction to solve the ultra-high heat flux dissipation problem. This article reviews the application of diamond based materials in efficient heat dissipation, and discusses the main methods of fabricating surface micro-channels of diamond heat sink. The development and application of diamond based materials for efficient heat dissipation technology can provide technical support for solving the problem of high heat flux dissipation.-
Key words:
- diamond /
- microchannel /
- efficient heat dissipation /
- fabrication
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