Numerical simulation of multiphysics coupling for magnetic fluid grinding of germanium wafer by rotating magnetic field
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摘要:
为了提高锗片的表面质量，采用旋转磁场磁流体研磨的方法，以数值模拟为研究手段，研究锗片表面在固液两相流作用下的材料去除行为。依据磁流体的研磨原理建立仿真模型，从磁流体研磨的工艺参数出发，结合有限元分析以表面力学特性为切入点，分析不同励磁间隙、磁极转速、颗粒相体积分数等加工参数对锗片表面质量的影响，确定其最佳加工工艺参数，并进行磁流体研磨试验。结果表明：在励磁间隙为5 mm，磁极转速为1 000 r/min，颗粒相体积分数为25%时，经过60 min研磨，锗片的表面质量得到有效改善，其表面粗糙度Ra由500 nm下降到47 nm，实现了锗片表面微小的塑性材料去除。
Abstract:In order to improve the surface quality of germanium wafer, the material removal behavior of germanium wafer under the action of solid-liquid two-phase flow was studied by means of rotating magnetic field magnetic fluid grinding and numerical simulation. Firstly, the grinding principle of magnetic fluid was introduced. Secondly, a simulation model was established. Starting from the process parameters of magnetic fluid grinding and combined with finite element analysis, the surface mechanical properties are taken as the breakthrough point. The effects of processing parameters such as different excitation gaps, magnetic pole rotation speeds, and particle phase volume fractions on the surface quality of the germanium wafer were analyzed. The optimal processing parameters were determined. Finally, the magnetic fluid grinding test was carried out. The results show that when the excitation gap is 5 mm, the magnetic pole rotation speed is 1000 r/min, and the volume fraction of the particle phase is 25%. After grinding for 60 minutes, the surface quality of germanium wafer was improved effectively, and the surface roughness Ra decreased from 500 nm to 47 nm, which realized the removal of small plastic materials on the surface of germanium wafer.
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图 1 旋转磁场磁流体研磨原理
Figure 1. Principle of magnetic fluid lapping with rotating magnetic field
图 3 不同励磁间隙下的磁感应强度分布图
Figure 3. Magnetic induction intensity distribution under different excitation gaps
图 4 不同励磁间隙下的磁感应强度沿x方向位置变化图
Figure 4. Position variation diagram of magnetic induction intensity along x direction under different excitation gaps
图 7 不同转速下的动态压强分布图
Figure 7. Dynamic pressure distribution at different rotational speeds
图 9 磁极转速对动态压强、剪切应力的影响
Figure 9. Influence of magnetic pole speed on dynamic pressure and shear stress
图 10 不同颗粒相体积分数下的动态压强分布图
Figure 10. Dynamic pressure distribution under different particle phase volume fractions
图 11 不同颗粒相体积分数下的剪切应力分布图
Figure 11. Shear stress distribution under different particle phase volume fractions
图 12 颗粒相体积分数对动态压强、剪切应力的影响
Figure 12. Influence of particle phase volume fraction on dynamic pressure and shear stress
图 13 金相显微镜观测加工前后表面形貌
Figure 13. Surface morphology observed by metallographic microscope before and after machining
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