Effect of SiC content on properties of copper matrix composites
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摘要: 采用热压粉末冶金法引入Al和Mg元素制备SiC/Cu复合材料，研究SiC体积分数对SiC/Cu复合材料性能的影响。采用X射线衍射、阿基米德排水法、三点弯曲法和扫描电镜分析复合材料样品的物相组成、相对密度、力学性能及微观形貌，并测定其导热系数和热膨胀系数，用ROM混合定律和Turner模型预测复合材料的热膨胀系数。结果表明：试样基体中生成了AlCuMg相，强度大幅增加，且以混合型断裂为主；当SiC体积分数较低时，SiC颗粒在基体中分散较均匀。当SiC体积分数为35%时，SiC/Cu复合材料的致密度、抗弯强度、导热系数和热膨胀系数分别为98.81%、478 MPa、254.76 W/(m·K)和11.84 × 10−6 /K。随着SiC体积分数的增加，SiC颗粒团聚较严重，复合材料的致密度、抗弯强度、导热系数和热膨胀系数随之降低，其硬度呈先增加后降低的趋势，在SiC体积分数为45%时达到最大值110 HRB。Turner模型的预测值与复合材料实测值最为接近。
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关键词:
- SiC/Cu复合材料 /
- AlCuMg /
- 力学性能 /
- 热学性能
Abstract: SiC/Cu composites were prepared by hot-pressing powder metallurgy with Al and Mg elements, and the effect of SiC volume percentage on the properties of SiC/Cu composites was studied. X-ray diffraction, Archimedes drainage method, three-point bending method and scanning electron microscope were used to analyze the phase composition, relative density, mechanical properties and micro-morphology of the composite samples, and the thermal conductivity and thermal expansion coefficient were measured. The thermal expansion coefficient of the composite was predicted by ROM mixing law and Turner model. Experimental results show that AlCuMg phase is formed in the matrix of the sample, and the strength is greatly increased, and the mixed fracture is the main type of the sample. The SiC particles are uniformly dispersed in the matrix when the SiC content is low. The density, bending strength, thermal conductivity and thermal expansion coefficient of SiC/Cu composites are 98.81%, 478 MPa, 254.76 W/(m·K) and 11.84 × 10−6/K respectively when the SiC content is 35%. When the content of SiC increases, the agglomeration of SiC particles is serious, and the density, bending strength, thermal conductivity and thermal expansion coefficient of the composites decrease. Its hardness increases at first and then decreases, and reaches the maximum value of 110 HRB when the SiC content is 45%. The Turner model is the closest to the measured values of composites.-
Key words:
- SiC/Cu composites /
- AlCuMg /
- mechanical property /
- thermal performance
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图 1 不同SiC体积分数下烧结样品的XRD图谱
Figure 1. XRD spectra of sintered samples with different SiC volume fractions
图 2 不同SiC体积分数的SiCp/Cu复合材料的硬度和抗弯强度
Figure 2. Hardness and flexural strength of SiCp/Cu composites with different SiC contents
图 3 不同SiC体积分数的SiCp/Cu复合材料导热系数
Figure 3. Thermal conductivity of SiCp/Cu composites with different SiC contents
图 4 不同SiC体积分数的SiCp/Cu复合材料热膨胀系数的预测值和实测值
Figure 4. Predicted and measured thermal expansion coefficients of SiCp/Cu composites with different SiC contents
图 5 不同SiC体积分数下样品的断口形貌
Figure 5. Fracture morphologies of samples with different SiC volume fractions
表 1 试样的密度和致密度
Table 1. Density and density of SiCp/Cu composites
SiC体积
分数 ω / %理论密度
ρ理 / (g·cm−3)实测密度
ρ测 / (g·cm−3)致密度
Ρ致 / %35 6.06 5.99 98.81 40 5.78 5.70 98.56 45 5.52 5.26 95.24 50 5.22 4.78 91.52 55 4.96 4.23 85.32 60 4.68 3.76 80.32 
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