Study on chip formation in grinding nickel-based single-crystal superalloy DD5
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摘要: 为研究镍基单晶高温合金DD5的磨削去除机理，提高其加工效率，针对镍基单晶高温合金具有显著各向异性的特点，建立基于Hill模型的三维有限元磨削模型，研究镍基单晶高温合金DD5的表面加工形貌和切屑形貌，分析切屑形貌演变过程及其磨削力变化，探究磨削速度对切屑形貌和切屑形成频率的影响。研究表明：在磨削参数范围内，加工DD5容易出现锯齿形切屑；磨削力呈稳定增加并伴有一定的周期性波动，其波动情况与锯齿形切屑相对应；随着磨削速度的增大，磨粒能更快进入切削阶段，其临界成屑厚度由0.225 μm最终降为0.158 μm，成屑阶段占比由85.0%提高到89.5%；临界划擦厚度受磨削速度变化影响不大；随着磨削速度的增加，DD5切屑形貌由锯齿分节密集堆叠的单元节状向连续型锯齿状转变，最后发展为条形带状切屑。
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关键词:
- 磨削 /
- 切屑形貌 /
- 镍基单晶高温合金DD5 /
- 有限元分析
Abstract: According to the significant anisotropy of nickel-based single-crystal superalloy, a three-dimensional single abrasive grinding model based on the Hill model was developed. In this work, the change in the actual grinding thickness (ag) of the abrasive is taken into account in establishing the model. In addition, a combination of theoretical research and experimental research is used. The surface morphology and chip morphology of DD5 were first studied. Then, the evolution of chip morphology and the change in grinding force were investigated. Finally, the influence of grinding speed (vs) on chip morphology and chip segmentation frequency (fc) was studied. The research shows that serrated chips can easily occur when machining DD5 within the range of grinding parameters. The grinding force increased steadily and was accompanied by inevitable periodic fluctuations corresponding to serrated chips. As the grinding speed increased, the abrasive could enter the cutting stage more quickly, and its critical chip thickness (acr) eventually decreased from 0.225 μm to 0.158 μm. The percentage of the cutting phase increased from 85% to 89.5%. However, the critical scratch thickness was not significantly influenced by the change in grinding speed. The grinding speed and thickness substantially influence the morphology and segmentation frequency of DD5 chips. Specifically, as the grinding speed continues to increase, the DD5 chip morphology changes from a densely stacked unit nodal shape with serrated subsections to a continuous type of serrated shape and finally develops into a strip-shaped chip. At different grinding speeds, the chip segmentation frequency of DD5 decreases with increasing grinding depth. -
图 1 镍基单晶高温合金DD5及其微观组织
Figure 1. Nickel-based single crystal superalloy DD5 and its microstructure
图 6 DD5磨削后表面形貌和切屑形态
Figure 6. Surface topology of DD5 after grinding and its chip shape
图 7 DD5锯齿形切屑的形成过程
(a) 1.080 μm; (b) 1.095 μm; (c) 1.125 μm; (d) 1.140 μm; (e) 1.155 μm; (f) 1.178 μm.
Figure 7. Serrated chip formation of DD5
图 8 DD5在不同单颗磨粒切削深度下的切屑形貌图
(a) 0.038 μm; (b) 0.188 μm; (c) 0.300 μm; (d) 0.600 μm; (e) 1.050 μm; (f) 1.275 μm
Figure 8. Chip morphology of DD5 at different single abrasive cutting depths
图 9 DD5在不同磨削速度下磨削三阶段的转变情况
Figure 9. Three-stage transition of DD5 grinding at different grinding speeds
图 10 DD5在不同单颗磨粒磨削速度下的应变率分布
Figure 10. Strain rate distribution of DD5 at different grinding speeds of single abrasive
图 11 锯齿形切屑形成过程中一个周期内的法向磨削力变化
Figure 11. Change of normal grinding force in one cycle during the formation of serrated chips
图 12 单颗磨粒磨削DD5在不同磨削速度下的法向磨削力变化
Figure 12. Change of normal grinding force of DD5 grinding with single abrasive at different grinding speeds
图 14 磨削速度对切屑形貌的影响
(a) 15 m/s; (b) 25 m/s; (c) 35 m/s; (d) 45 m/s; (e) 60 m/s; (f) 100m/s
Figure 14. Effect of grinding speed on chip morphology
图 15 DD5磨削试验过程中磨削速度对切屑形貌的影响
(a) 整体切屑形貌 Over all morphology of chips (b) 15 m/s; (c) 25 m/s; (d) 35 m/s.
Figure 15. Effect of grinding speed on chip morphology during DD5 grinding experiment
表 1 DD5主要物理性能
Table 1. Main physical properties of DD5
序号 硬度
H屈服强度
σs弹性模量
E泊松比
ν熔点
Tm收缩比
SDD5 550 HV 1109 MPa 134.7 GPa 0.419 1368 °C 13.5% 
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表 2 单颗磨粒的具体磨削参数
Table 2. Grinding parameters of single abrasive
类型 取值 磨削速度 vs / (m·s−1) 15, 25, 35, 45, 60, 80, 100 最大未变形切削厚度 agmax / µm 1.5
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