金刚石刀具微纳米切削单晶镍亚表面损伤

孙思光; 李翔

doi:10.13394/j.cnki.jgszz.2022.0149

金刚石刀具微纳米切削单晶镍亚表面损伤

doi: 10.13394/j.cnki.jgszz.2022.0149

孙思光^1,,
李翔²

1.
唐山劳动技师学院电气工程系, 河北唐山 063000
2.
辽宁石油化工大学机械工程学院, 辽宁抚顺 113001

基金项目: 河北省人力资源社会保障厅课题（JRSJY-2022-1041）。

详细信息

作者简介:
孙思光，男，1985年生，本科。主要研究方向：电气自动化。E-mail：371168557@qq.com

中图分类号: TQ164；TG58；TG71；TH161
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- 被引次数: 0
出版历程
- 收稿日期: 2022-09-10
- 修回日期: 2022-10-15
- 录用日期: 2022-10-28
- 刊出日期: 2023-06-20

Subsurface damage of single crystal nickel by micro-nanometric cutting with diamond tool

SUN Siguang^1
,,
LI Xiang²

1.
Department of Electrical Engineering, Tangshan Labor Technician College, Tangshan 063000, Hebei, China
2.
School of Mechanical Engineering, Liaoning Petrochemical University, Fushun 113001, Liaoning, China

摘要

摘要: 采用分子动力学软件Lammps研究金刚石刀具微纳米切削单晶镍的微观动态过程，分析不同切削方向和不同切削深度下单晶镍微纳米切削过程中缺陷的类型、切削力和损伤的关系以及位错线的演化规律。结果表明：刀具的挤压和剪切作用使单晶镍工件产生高压相变区和非晶区，其亚表层存在原子团簇和位错滑移。沿[100]晶向切削，切削力最小，且位错损伤层厚度最小为2.15 nm；沿[111]晶向切削，表面层的质量最好，但损伤层厚度最大为3.75 nm。切削过程中，位错线的总长度整体呈上升趋势，[110]方向去除的原子区域最大，位错线长度最大。切削深度越大，晶体内部的位错滑移和非晶化越严重。
- 分子动力学 /
- 单晶镍 /
- 微纳米切削 /
- 损伤 /
- 切削力 /
- 位错线
Abstract: The micro-dynamic process of diamond tool micro-nanometric cutting single crystal nickel was studied by molecular dynamics software Lammps. The types of defects, the relationship between cutting force and damage, and the evolution of dislocation lines during micro-nanometric cutting of single crystal nickel under different cutting directions and depths were analyzed. The results show that the high pressure phase transition zone and amorphous zone are formed in the single crystal nickel workpiece due to the extrusion and shearing of the tool, and there are atomic clusters and dislocation slip in the subsurface layer. The cutting along the [100] crystal direction has the smallest cutting force and the minimum thickness of the dislocation damage layer is 2.15 nm. The cutting along the [111] crystal direction has the best surface layer quality, but the maximum thickness of the damage layer is 3.75 nm. In the cutting process, the total length of dislocation line presents an overall upward trend, and the atom region removed in [110] direction as well as the dislocation line length are the largest. The greater the cutting depth is, the more serious the dislocation slip and the amorphous in the crystal become.
- molecular dynamics /
- single crystal nickel /
- micro-nanometric cutting /
- damage /
- cutting force /
- dislocation line

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图 1 金刚石刀具微纳米切削单晶镍模型

Figure 1. Model of single crystal nickel cutting with diamond tool

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图 2 沿[100]方向切削单晶镍中心的对称参数图像

Figure 2. Centrosymmetric parameter image of single crystal nickel cutting along the [100] direction. (velocity is 100 m/s, cutting

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图 3 沿[100]方向切削单晶镍的位错线类型

Figure 3. Types of single crystal nickel dislocation lines cutting along the [100] direction

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图 4 沿[100]、[110]、[111]方向切削单晶镍的切削力

Figure 4. Cutting force of single crystal nickel along [100], [110], [111] directions

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图 5 沿[100]、[110]、[111]方向切削单晶镍的亚表面损伤层

Figure 5. The subsurface damage layer of single crystal nickel cutting along the [100], [110], [111] directions

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图 6 沿[100]、[110]、[111]方向切削单晶镍的表面形貌和原子堆积

Figure 6. Atomic stacking on the surface morphology of single crystal nickel cutting along the [100], [110], [111] directions

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图 7 堆积的镍原子的数量

Figure 7. The number of stacked nickel atoms

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图 8 沿[100]方向切削单晶镍的位错线变化

Figure 8. Variation of dislocation lines of single-crystal nickel cutting along the [100] direction

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图 9 沿[100]、[110]、[111]方向切削单晶镍位错线长度的变化

Figure 9. Variation of the length of dislocation lines of single crystal nickel cutting along the [100], [110] and [111] direction

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图 10 不同切削深度下摩擦系数的变化

Figure 10. Variation of friction coefficient at different cutting depths

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图 11 不同切削深度下位错线长度和晶体结构

Figure 11. Length of dislocation line and crystal structure at different cutting depths

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图 12 不同切削深度下单晶镍亚表层缺陷DXA图

Figure 12. DXA diagram of single crystal nickel subsurface defects at different cutting depths

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