磨料质量分数对磨硅片用金刚石砂轮磨削性能的影响

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磨料质量分数对磨硅片用金刚石砂轮磨削性能的影响

骆苗地, 赵金伟, 丁玉龙, 苗卫朋, 包华, 张云鹤

文章导航 > 金刚石与磨料磨具工程 > 2021 > 41(6): 80-84

骆苗地, 赵金伟, 丁玉龙, 苗卫朋, 包华, 张云鹤. 磨料质量分数对磨硅片用金刚石砂轮磨削性能的影响[J]. 金刚石与磨料磨具工程, 2021, 41(6): 80-84. doi: 10.13394/j.cnki.jgszz.2021.6.0014

引用本文:

骆苗地, 赵金伟, 丁玉龙, 苗卫朋, 包华, 张云鹤. 磨料质量分数对磨硅片用金刚石砂轮磨削性能的影响[J]. 金刚石与磨料磨具工程, 2021, 41(6): 80-84. doi: 10.13394/j.cnki.jgszz.2021.6.0014

LUO Miaodi, ZHAO Jinwei, DING Yulong, MIAO Weipeng, BAO Hua, ZHANG Yunhe. Effect of abrasive mass fraction on grinding performance of diamond grindingwheel for grinding silicon wafer[J]. Diamond & Abrasives Engineering, 2021, 41(6): 80-84. doi: 10.13394/j.cnki.jgszz.2021.6.0014

Citation:

LUO Miaodi, ZHAO Jinwei, DING Yulong, MIAO Weipeng, BAO Hua, ZHANG Yunhe. Effect of abrasive mass fraction on grinding performance of diamond grindingwheel for grinding silicon wafer[J]. Diamond & Abrasives Engineering, 2021, 41(6): 80-84. doi: 10.13394/j.cnki.jgszz.2021.6.0014

骆苗地, 赵金伟, 丁玉龙, 苗卫朋, 包华, 张云鹤. 磨料质量分数对磨硅片用金刚石砂轮磨削性能的影响[J]. 金刚石与磨料磨具工程, 2021, 41(6): 80-84. doi: 10.13394/j.cnki.jgszz.2021.6.0014

引用本文:

骆苗地, 赵金伟, 丁玉龙, 苗卫朋, 包华, 张云鹤. 磨料质量分数对磨硅片用金刚石砂轮磨削性能的影响[J]. 金刚石与磨料磨具工程, 2021, 41(6): 80-84. doi: 10.13394/j.cnki.jgszz.2021.6.0014

LUO Miaodi, ZHAO Jinwei, DING Yulong, MIAO Weipeng, BAO Hua, ZHANG Yunhe. Effect of abrasive mass fraction on grinding performance of diamond grindingwheel for grinding silicon wafer[J]. Diamond & Abrasives Engineering, 2021, 41(6): 80-84. doi: 10.13394/j.cnki.jgszz.2021.6.0014

Citation:

LUO Miaodi, ZHAO Jinwei, DING Yulong, MIAO Weipeng, BAO Hua, ZHANG Yunhe. Effect of abrasive mass fraction on grinding performance of diamond grindingwheel for grinding silicon wafer[J]. Diamond & Abrasives Engineering, 2021, 41(6): 80-84. doi: 10.13394/j.cnki.jgszz.2021.6.0014

磨料质量分数对磨硅片用金刚石砂轮磨削性能的影响

doi: 10.13394/j.cnki.jgszz.2021.6.0014

骆苗地^1,2,
赵金伟¹,
丁玉龙^1,2,
苗卫朋^1,2,
包华^1,2,
张云鹤¹

1. 郑州磨料磨具磨削研究所有限公司, 郑州 450001;
2. 超硬材料磨具国家重点实验室, 郑州 450001

基金项目:

国机集团重大科技专项(SINOMAST-ZDZX-2018-05)。

作者简介:
骆苗地,女,1989年生,硕士、工程师。主要研究方向：超硬磨具制造技术。E-mail: 295950856@qq.com

中图分类号: TG74;TG58
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- 文章访问数: 253
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出版历程
- 修回日期: 2021-05-10
- 网络出版日期: 2022-04-07

Effect of abrasive mass fraction on grinding performance of diamond grindingwheel for grinding silicon wafer

1. Zhengzhou Research Institute for Abrasive & Grinding Co., Ltd., Zhengzhou 450001, China;
2. State Key Laboratory of Superabrasives, Zhengzhou 450001, China

摘要: 采用改进的凝胶注模技术制备多孔陶瓷结合剂超细金刚石砂轮，研究6种不同质量分数磨料(质量分数分别为27%、30%、33%、36%、39%、42%)的多孔金刚石砂轮的显微结构和磨削性能。结果表明：磨料的质量分数直接影响砂轮磨削时的磨削电流、砂轮磨损速率，进而影响硅片磨削后的表面一致性。使用磨料质量分数为39%的砂轮时，硅片磨削后可获得粗糙度为4.8 nm的光滑表面。
- 磨料质量分数 /
- 陶瓷结合剂 /
- 磨削性能 /
- 硅片
Abstract: The porous vitrified-bond ultrafine diamond grinding wheel was fabricated through a modified gel casting technique in this study. Meanwhile, the microstructure and grinding performance of porous vitrified-bond ultrafine diamond grinding wheels, were evaluated at six different abrasive fractions (27%, 30%, 33%, 36%, 39%, 42% in mass percentage, respectively). The abrasive fraction was found to play an important influence directly on the grinding current, wheel wear rate and hence affected the surface integrity of Si wafers. Results revealed that a smooth surface with roughness of 4.8 nm was achieved by using the grinding wheel with abrasive fraction of 39%.
- abrasive mass fraction /
- vitrified-bond /
- grinding performance /
- silicon wafer

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