Abstract: To solve the problem of burr defects in existing punching 5G copper clad laminate (CCL) composites, a new process of grinding with sintered diamond slotted slice wheel is proposed. Based on the analysis and design of slotted wheel structure parameters, the sintered diamond slotted slice wheel is developed. The influence of different process parameters on the burr of up and low copper layer and the temperature change of grinding zone is studied. The experimental results show that the unit Z-direction grinding force increases with the increase of grinding speed, decreases with the increase of feed speed, and increases first and then decreases with the increase of grinding wheel cutting angle. The trend of burr flash height is opposite to the unit Z grinding force. The grinding temperature increases with the increase of the grinding speed, increases with the increase of the feed speed, and increases first and then decreases with the increase of the cutting angle of the grinding wheel. The optimal parameters for grinding 5G CCL are grinding speed 34.56 m/s, feed speed 1 200 mm/min and cutting angle 22.0°. Under this parameter, the height of burr flash is less than 300 μm, and the temperature of grinding zone is lower.