钎焊金刚石磨粒钻钻削C/SiC陶瓷基复合材料孔时切屑对钻削过程的影响

邵国栋; 史振宇

doi:10.13394/j.cnki.jgszz.2021.0212

钎焊金刚石磨粒钻钻削C/SiC陶瓷基复合材料孔时切屑对钻削过程的影响

doi: 10.13394/j.cnki.jgszz.2021.0212

邵国栋,
史振宇^,

山东大学机械工程学院, 高效洁净机械制造教育部重点实验室，济南 250061

基金项目: 国家自然科学基金(51975334，U21A20134)；山东大学齐鲁青年学者计划；山东省军民科技融合重点研发计划（2019JMRH0407）

详细信息

通讯作者:
史振宇，女，1984年生，教授、博士生导师。主要研究方向：复合材料加工技术。E-mail：shizhenyu@sdu.edu.cn

中图分类号: TG74; TG58; TQ164
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出版历程
- 收稿日期: 2021-12-29
- 修回日期: 2022-03-08
- 刊出日期: 2022-07-13

Effect of chips on drilling process when drilling C/SiC ceramic matrix composite holes with brazed diamond abrasive drill

SHAO Guodong,
SHI Zhenyu^,

Key Laboratory of the Ministry of Education of Efficient and Clean Machinery Manufacturing, School of Mechanical Engineering, Shandong University, Jinan 250061, China

摘要

摘要: 钎焊金刚石磨粒钻适合钻削碳纤维增强碳化硅陶瓷基复合材料孔，但大量切屑会对孔的钻削过程产生不利影响。为此，针对切屑排出过程，分析切屑形貌，研究钻削时切屑对轴向钻削力、孔加工质量、钻头磨损的影响。结果表明：切屑对轴向钻削力有影响，尤其钻削深孔时影响显著。切屑对孔进口的加工质量几乎没有影响，只表现为孔进口处的轻微崩边；切屑对孔出口的加工质量影响显著，可引起严重的纤维断裂、撕裂缺陷以及基体的大区域脱落。同时，切屑加剧钻头磨损，使钻头不仅出现崩刃、微裂纹等轻微磨损，而且还产生基体剥落、金刚石剥落等严重磨损行为。
- 碳纤维增强碳化硅陶瓷基复合材料 /
- 钎焊金刚石磨粒钻 /
- 切屑 /
- 轴向钻削力 /
- 钻头磨损
Abstract: Brazed diamond abrasive drill was suitable for drilling holes in carbon fiber reinforced silicon carbide ceramic matrix composites, but a large amount of chips could adversely affect the drilling process of the holes. Therefore, according to the chip discharge process, the chip morphology was analyzed, and the effects of chips on the axial drilling force, the hole processing quality and the drill wear during drilling were studied. The results show that the chips have an effects on the axial drilling forces, especially when drilling deep holes. The chips have little effects on the machining quality of the hole inlet, only a slight edge collapses at the hole inlet. The chips have a significant impacts on the processing quality of the hole outlet, which can cause serious fiber breakage, tear defects, and large areas of the matrix shedding. At the same time, the chip intensifies the drill wear, which not only causes slight wear such as edge collapse and micro crack, but also produces serious wear behaviors such as matrix peeling and diamond peeling.
- C/SiC ceramic matrix composite /
- brazed diamond abrasive drill /
- chip /
- axial drilling force /
- drill wear

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图 1 麻花钻及钎焊金刚石磨粒钻钻削加工时切屑的产生及运动路线

Figure 1. Generation and movement path of chips during drilling with twist drill and brazed diamond abrasive drill

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图 2 C/SiC的SEM形貌和EDX分析图

Figure 2. SEM morphology and EDX analysis of C/SiC

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图 3 C/SiC陶瓷基复合材料的XRD分析

Figure 3. XRD analysis of C/SiC ceramic matrix composite

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图 4 钻头形貌

Figure 4. Drill morphology

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图 5 实验设计

Figure 5. Experimental design

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图 6 切屑的SEM形貌

Figure 6. SEM morphology of chips

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图 7 对照组和实验组的钻削力

Figure 7. Drilling forces of control group and experimental group

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图 8 孔进口形貌

Figure 8. Morphology of hole inlet

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图 9 孔出口形貌

Figure 9. Morphology of hole outlet

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图 10 对照组钻削10个1/2孔后的钻头形貌

Figure 10. Drill morphology after drilling 10 1/2 holes in the control group

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图 11 实验组钻削5个全孔后的钻头形貌

Figure 11. Drill morphology after drilling 5 full holes in the experimental group

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表 1 C/SiC的力学和物理性能参数

Table 1. Mechanical and physical properties of C/SiC

参数	取值
密度 ρ / （g·cm⁻³）	1.9
孔隙率 φ / %	5
拉伸强度 σ₁ / MPa	87.5
压缩强度 σ₂ / MPa	460
弯曲强度 σ₃ / MPa	260
弹性模量 E / GPa	40
层间剪切强度 σ₄ / MPa	20
断裂韧性 K_IC / (MPa·m^1/2)	10
SiC基体硬度 H / GPa	22.2

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