Influence of structure of vitrified bond diamond grinding wheel on its performance
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摘要: 研究单晶硅片磨削用陶瓷结合剂金刚石砂轮的组织结构对砂轮性能的影响,评估砂轮组织结构对砂轮磨损速率、磨床主轴电流、磨削后的单晶硅片表面粗糙度及其表面形貌的影响。试验结果显示:主轴电流随着砂轮组织中孔隙率的增加呈现下降趋势,从最高的7.0 A降低至6.3 A;砂轮的磨损速率则表现出相反的规律,气孔率最大的砂轮的磨损速率是最小的砂轮的近2倍,分别为2.525 2 μm/片和1.423 8 μm/片;砂轮组织结构对磨削后工件的表面粗糙度影响不大,工件的表面粗糙度Ra值分别为7.67、7.47和7.37 nm;但当气孔孔径过大、孔壁变薄时,会造成磨削工件表面出现深划痕,导致硅片磨削质量恶化。Abstract: The influence of structure of vitrified bond diamond grinding wheel on the grinding performance for silicon wafer was studied. The influence of structure on grinding wheel wear and spindle current was evaluated, and the surface roughness and surface morphology of ground silicon wafer were measured. The results show that the spindle current decreases from the highest 7.0 A to 6.3 A with the increase of the porosity of grinding wheel tissue. On the other hand, the wear rate of grinding wheel shows the opposite rule, which is from 1.423 8 μm per piece to 2.525 2 μm per piece, as the porosity of the wheel ranges from its valley to the peak. It is also found that the structure has little influence on the surface roughness of the workpiece, which is 7.67 nm, 7.47 nm and 7.37 nm, respectively. However, when the pore diameter is too large and the hole wall becomes thinner, deep scratches will appear on the surface of the workpiece and the grinding quality of silicon wafer will be deteriorated.
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Key words:
- silicon wafer /
- grinding /
- vitrified bond wheel /
- diamond wheel /
- porosity /
- grinding wheel structure
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