Review of monocrystalline silicon slicing technology
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摘要: 单晶硅切片加工是集成电路产业和光伏产业的重要环节,其加工方式和加工质量直接影响到晶片的出片率、晶圆衬底和光伏太阳能电池板的生产成本。随着晶片尺寸的不断增大,线锯切片技术已成为目前单晶硅片的主流切片加工技术。为实现单晶硅片高效、精密、低裂纹损伤的切片加工,阐述了线锯切片技术的分类及其加工特点,总结了金刚石线锯切片加工机理的研究现状,探讨了对金刚石线锯切片加工过程的微观分析,概括了单晶硅切片加工引起的裂纹损伤及其抑制措施,指出了单晶硅切片加工技术的发展趋势和面临的挑战。Abstract: Slicing of monocrystalline silicon is an important process in integrated circuit industry and photovoltaic industry, where the slicing method and qualities directly affect the yield of sliced wafers and the cost of wafer substrate and photovoltaic solar cells. With the increase of wafer size, wire sawing technology has become the mainstream slicing technology of monocrystalline silicon. To realize high efficiency, precision and low crack damage slicing of monocrystalline silicon, this study presents two most commonly used slicing methods and their slicing characteristics, reviews the slicing mechanism and micro processing analysis of diamond wire sawing technology, summarizes the research on slicing induced crack damage and its suppression methods, and points out the development prospects and challenges of monocrystalline silicon slicing technology.
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Key words:
- monocrystalline silicon /
- diamond wire saw /
- slicing technology /
- wafer substrate
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