Surface characteristics and wire wear of electroplated diamond wire saw slicing photovoltaic polycrystalline silicon
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摘要: 电镀金刚石线锯切割的光伏多晶硅切片表面特性,影响其断裂强度和后续的制绒工艺;为探究线锯锯切工艺参数对多晶硅切片表面特性的影响规律,揭示电镀金刚石锯丝的磨损机理,开展了光伏多晶硅的电镀金刚石线锯切片试验。研究结果表明:锯切的多晶硅表面存在由金刚石磨粒的塑性剪切、微切削去除形成的塑性浅划痕与较深的沟槽,及材料脆性去除留下的表面破碎微凹坑;切片表面材料的塑性去除和脆性去除相对比例随工艺参数组合变化而变化,增大晶片进给速度,降低走丝速度,切片表面粗糙度增大,表面形貌逐渐由塑性沟槽为主转变为以破碎微凹坑为主;使用表面镀镍(金属化)的金刚石颗粒制备的电镀金刚石锯丝的磨损形态在稳定阶段主要是磨粒磨平,使用后期主要是磨粒脱落和镀层磨损。Abstract: The surface characteristics of photovoltaic (PV) polycrystalline silicon cut by electroplated diamond wire saw affects the fracture strength and the subsequent texture process of wafers. The experiment of electroplated diamond wire sawing PV polycrystalline silicon was conducted in order to analyze the sliced wafer surface characteristics, investigate the influence of sawing parameters on the sawn surface characteristics and reveal the wire saw wear mechanism. The results show that there are shallow ductile scratches and deep grooves formed by ductile shear micro-cutting of diamond abrasives, and fracture micro-pits left by brittle removal of materials on the sawn polysilicon surface. The relative proportion of materials brittle removal to ductile removal varies with the change of process parameters combination. Increasing the feed rate of crystals and decreasing the wire speed, the surface roughness of sliced wafer increases and the sawn surface topography gradually changes from ductile grooves to fracture micro-pits. The wear forms of electroplated diamond saw wire fabricated by nickel-coated (metallized) diamond abrasives are as follows: abrasive flattening is the main wear form in steady wear stage, and abrasives-pulled out and coating wear are the main wear forms in late-use period.
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