Abstract: In order to improve the thinning effect on the back of silicon wafer, a pore-forming agent was added into the resin-bonded silicon wafer thinning wheel. The effects of pore-forming agent content on the structure and grinding performance of resin-bonded grinding wheel were studied by volume density measurement, SEM observation and grinding experiments.The results show that with the increase of pore-forming agent volume fraction and the decrease of feeding ratio, the internal porosity of grinding wheel increases, and grinding experiments show that pore-forming agent can improve the surface quality of silicon wafer.When the volume fraction of pore-forming agent is 10% and the volume density feeding ratio is controlled at 75%, the resin-bonded silicon wafer thinning wheel has better comprehensive grinding performance. The fluctuation range of R_a, R_z and R_y values of the surface roughness of the silicon wafer ground by this wheel is small. Compared with the silicon wafer ground by the grinding wheel under other conditions, the surface consistent of the silicon wafer is good.