Study on preparation of diamond/copper compositesby high temperature and high pressure method
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摘要:
采用高温高压法制备金刚石/铜复合材料。研究金刚石体积分数、烧结压力、保温时间、烧结温度、金刚石表面金属化对金刚石/铜复合材料热导率及热膨胀系数的影响。实验表明:金刚石体积分数70%,烧结压力2 GPa,烧结时间300 s,烧结温度1200℃时,金刚石/铜复合材料热导率达426 W/(m·K)。
Abstract:Diamond-copper composites were prepared by high temperature and high pressure method (HPHT). The effects of diamond volume fraction, sintering pressure, holding time, sintering temperature, surface metallization of diamond on thermal conductivity and thermal expansion coefficient of diamond-copper composites were studied. The experimental results show that when diamond volume fraction is 70%, sintering pressure is 2 GPa, sintering time is 300 s, and sintering temperature is 1200℃, the thermal conductivity of diamond-copper composite material reaches 426 W/(m·K).
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