Experimental study on surface topography and tensile ultimate load of diamond wire saw during life cycle in machining sapphire
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摘要: 为优化金刚石线锯多线切割加工蓝宝石晶片的工艺参数,通过加工实验,获得金刚石线锯生命周期内各个阶段样本,采用扫描电镜分析样本表面形貌;用拉伸试验机对样本抗拉极限载荷进行测试,得到样本的抗拉极限载荷,并对断口形貌进行分析。实验结果表明:金刚石磨粒在生命周期内,经历包覆磨损、显露、碎裂、脱落的过程;磨粒碎裂是导致脱落的主要原因;生命周期内,金刚石线锯抗拉极限并没有随着线磨损、金刚石颗粒掉落而降低;断口分为裂纹扩展区、瞬断区、电镀层区,且电镀层区与瞬断区发生分离。在分析结果的基础上,给出工艺参数优化方法。Abstract: In order to optimize the process parameters for slicing sapphire wafer through multi-wire sawing with diamond wire saw, the diamond wire samples of the different stages are obtained by machining tests.The surface morphology of these samples are observed through scanning electron microscopy, while the tensile ultimate load of the samples are tested by tensile testing machine and the fracture morphology is analyzed.The experimental results show that the diamond particles in the life cycle experience the process of cladding worn, baring, cracking and falling off.The diamond particle cracking is the main cause of falling.During life cycle, the tensile limit of the wire does not decrease with wire wear and falling of diamond particles.Furthermore, the fracture image of fracture test samples are divided into three zones:the crack propagation zone, transient breaking zone and the plating zone.The separating can be observed between the plating zone and the steel wire.On the basis of the analysis results, the optimization method of process parameter is given.
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Key words:
- diamond wire saw /
- sapphire /
- multi-wire sawing /
- surface topography
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