Characterization of wafer shape after grinding with diamond wheel
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摘要: 磨削减薄过程中,硅片表面产生亚表面损伤,其中的残余应力使硅片产生翘曲变形。因此,研究无光磨磨削时的硅片面形变化规律以评价其加工质量。使用金刚石砂轮无光磨磨削厚度400μm和450μm的硅片并测量其面形。将硅片面形数据从中心向边缘沿径向分割成5个环带,分别研究其面形拟合弯曲曲率半径变化。结果显示:从中心区域到边缘区域,硅片的变形量增大,说明无光磨硅片上的残余应力变大,即磨削加工损伤增大。同时,研究还发现晶向对硅片变形有显著影响,〈110〉晶向区变形与〈100〉晶向区变形差异明显。Abstract: Subsurface damage is formed in the silicon wafer during the thinning process,where residual stress causes defects.Therefore,variation law of the warping profile was studied in the silicon wafer without spark-out process.The silicon wafers were thinned to 400μm or 450μm by a diamond grinding wheel and their warping profiles were measured.The silicon surface profile was divided into five rings from the center to the edge in radial direction and the radius of curvature of each area was obtained by spherical fit respectively.By analyzing the warping profile,it is found that the deformation of the silicon wafer increases from the central area to the edge and it implies that the residual stress grows and so does the grinding damage.In addition,it is found that the crystal orientation has a significant effect on the deformation of silicon wafer,thus the deformation in the 〈110〉crystal orientation area quite different from that in the〈100〉crystal orientation area.
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Key words:
- wafer grinding /
- residual stress /
- curvature /
- crystal orientation
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