Abstract: In order to study the damage of monocrystalline silicon,it is ground using a diamond grinding block at different normal forces and velocities.The grain size of resin bond diamond grinding block is 38 to 45 μm.The surface roughness value R_a,subsurface damage depth d_sd and material removal rate MMR of monocrystalline silicon are measured to study the effect of grinding velocity and pressure on material removal quality.Resultsshow that the material removal rate of monocrystalline silicon firstly increases and then decreases with the increase of the grinding velocity,whereas the depth of subsurface damage decreases monotonically.The change of the subsurface damage depth is not obvious as normal force increases.When the normal force is 5 N,R_a decreases obviously with the increasing grinding speed.However,when the normal force is 10 N,R_a tends to be stable.