Abstract: To prepare material with higher thermal conductivity,new diamond/copper composite material was hot-pressed using powder metallurgy method with diamond and high purity copper powders.Orthogonal analysis was used to study the influencing factors of thermal conductivity of diamond/copper composite material.Resultsshowed that maximum thermal conductivity of new material was 245.89 W/(m·K)and that volume ratio of diamond to copper powders influenced thermal conductivity most. With the increase of volume ratio,thermal conductivity of diamond/copper composite material gradually decreased.Densification and interface bonding factor were important factors as well.Composite material with higher densification and better interface bonding possessed higher thermal conductivity and vice versa.