SiCp/Al复合材料纳米压痕/划痕下的脆塑性行为研究

刘亚梅; 王佳力; 谷岩; 吴爽; 李震

doi:10.13394/j.cnki.jgszz.2023.0165

SiCp/Al复合材料纳米压痕/划痕下的脆塑性行为研究

doi: 10.13394/j.cnki.jgszz.2023.0165

长春工业大学机电工程学院, 长春 130012

基金项目: 吉林省科技发展项目（20230201103GX）。

详细信息

作者简介:
刘亚梅，女，1970年生，硕士、教授。主要研究方向：机械电子工程/自由曲面精加工。E-mail：949823612@qq.com

通讯作者:
谷岩，男，1980年生，博士、副教授。主要研究方向：微纳制造与数控装备。E-mail：guyan@ccut.edu.cn

中图分类号: TG58; TB333
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出版历程
- 收稿日期: 2023-08-21
- 修回日期: 2023-12-19
- 录用日期: 2023-12-28
- 刊出日期: 2024-10-01

Research of brittle-plastic behavior of SiCp/Al composites based on nano-indentation/scratch

School of Mechanical and Electrical Engineering, Changchun University of Technology, Changchun 130012, China

摘要

摘要: 为探究SiCp/Al复合材料中两相材料相互作用引起的力学性能差异，研究微观尺度下法向载荷变化对SiCp/Al复合材料形变和去除的影响。采用纳米压痕实验，基于Oliver-Pharr法测得其硬度和弹性模量，并对其压痕表面进行观察，结合有限元仿真分析产生力学性能差异的原因；同时，根据纳米压痕实验所得力学参数进行变载荷纳米划痕仿真，并配合实验后划痕表面观察结果分析材料的形变和脆塑性行为。结果表明：当金刚石压头作用于SiC颗粒时，颗粒出现破碎和二次压入现象，所测硬度与弹性模量小于单晶SiC的理论值；当金刚石压头作用于基体相时，由于SiC颗粒阻碍基体压入，复合材料的硬度与弹性模量测量结果偏大。在纳米划痕过程中，复合材料的去除形式随载荷变化体现为划擦、耕犁和切削阶段，其中的基体相通过塑性流动产生塑性脊堆积并伴随有涂覆现象，SiC颗粒则以脱黏、断裂破碎和拔出等脆性机制而去除，且SiC颗粒的二次压入、断裂、破碎和拔出是导致复合材料力学性能与单晶SiC的力学性能产生巨大差异的主要原因。随着划痕载荷增加，SiC体积分数为45 %的SiCp/Al复合材料的去除机制更多取决于以塑性去除为主的基体相，而SiC颗粒则主要表现为脆性去除。
- 纳米压痕/划痕 /
- SiCp/Al复合材料 /
- 有限元仿真 /
- 力学性能 /
- 去除机制
Abstract: Objectives: SiCp/Al composite is a kind of particle-reinforced metal matrix composite, which offers high specific strength and low density. It is widely used in electronic packaging, aerospace and automobile manufacturing. Although the presence of a large number of SiC particles improves the mechanical properties of the material, it also presents significant challenges in processing. As the volume fraction of SiCp/Al composite material increases, its mechanical parameters such as hardness improve, but a large number of surface defects appear during processing.To improve the surface machining quality and select better machining parameters, it is crucial to investigate the mechanical properties and the removal mechanism of SiCp/Al composites with medium or high volume fraction. Methods: Nanoindentation is a commonly used method for testing hardness, which can quantitatively characterize the hardness, elastic modulus and other mechanical parameters of materials. It provides a theoretical basis for predicting machined surface roughness. The load-depth curves of SiCp/Al composites under specific indentation load and rate can be obtained through nanoindentation experiments. The hardness and elastic modulus of SiCp/Al composites are determined using the Oliver-Pharr method. Due to the presence of a large number of SiC particles in the SiCp/Al composite, different failure behaviors are observed when the diamond indenters applies loads to the SiC particles, Al matrix, and two-phase interfaces, resulting in significant differences in measured hardness and elastic modulus. After the indentation experiment, scanning electron microscope (SEM) is used to observe the indentation surface morphology, and the ABAQUS finite element software is used to simulate the indentation process of SiCp/Al composites. The reasons for the differences in mechanical properties are then analyzed based on the finite element simulation results and the experimental indentation surface defects. Results: It is found that when the diamond indenter acts on SiC particles, the experimental values of hardness and elastic modulus of the material are the largest, with average values of 22.75 GPa and 190.78 GPa, respectively. When the indenter acts on the matrix phase, the average values of hardness and elastic modulus are 1.39 GPa and 66.52 GPa, respectively. For the interface between the two phases, the average hardness and elastic modulus measured are 4.62 GPa and 84.38 GPa, respectively. Additionally, the nanoscratch experiment simplifies the complex interaction between abrasive particles and the workpiece during grinding. It explores the brittle-plastic transformation behavior and potensial surface defects of the material surface by applying loads to the workpiece. This is an effective method for studying the material removal form. The hardness and elastic modulus values obtained from the nanoindentation experiment are introduced into the scratch finite element simulation. A variable load of 0 to 400 mN is applied to the SiCp/Al composite, with the scratch speed fixed at 0.05 mm/s. The results show that the removal form of the material changes with the load during the scraping, ploughing and cutting stages. The matrix phase undergoes plastic plastic flow, causing plastic ridge accumulation with coating phenomenon, while the SiC particles are removed by brittle mechanisms such as debonding, breaking, and pulling out. Conclusions: In the indentation experiment, secondary indentation of SiC particles in SiCp/Al composites results in significant differences between the mechanical properties of SiC particles and the theoretical mechanical properties of SiC crystals. Due to fracture and breakage of the particles during the loading process of the diamond indenter, the test results tend to be exaggerated. As the scratch load increases, the removal form of SiCp/Al composites with a volume fraction of 45% replies more on the plastic removal of the matrix phase, while the removal form of SiC particles is mainly brittle. The brittle-plastic behavior of the material surface during machining, as analyzed by the nanoindentation/scratch experiments, provides a theoretical basis for predicting the material's surface quality during machining.
- nano-indentation/scratch /
- SiCp/Al composite material /
- finite element simulation /
- mechanical property /
- removal mechanism

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图 1 压痕仿真示意图

Figure 1. Schematic diagram of indentation simulation

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图 2 载荷-深度曲线与压痕截面轮廓

Figure 2. Load-depth curve and indentation cross-section profile

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图 3 纳米压痕设备与复合材料原始表面形貌

Figure 3. Nanoindentation equipment and original surface morphology of materials

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图 4 加载不同位置处的载荷-深度曲线

Figure 4. Load-depth curves at different loading positions

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图 5 金刚石压头作用于SiC颗粒处的压痕SEM形貌及其对应载荷−深度曲线与仿真结果

Figure 5. SEM morphology with its corresponding load-depth curve and simulation results of indentation on SiC particles with diamond indenter

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图 6 金刚石压头作用于两相界面处的压痕SEM形貌及其对应载-荷深度曲线与仿真结果

Figure 6. SEM morphology with its corresponding load-depth curve and simulation results of indentation at the interface between two phases with diamond indenter

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图 7 金刚石压头作用于基体相的压痕SEM形貌及其对应载-荷深度曲线与仿真结果

Figure 7. SEM morphology with its corresponding load-depth curve and simulation results of diamond indenter acting on matrix phase indentation

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图 8 划痕仿真示意图

Figure 8. Scratch simulation diagram

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图 9 变载荷划痕仿真云图

Figure 9. Variable load scratch simulation cloud map

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图 10 纳米划痕SEM形貌与局部放大图

Figure 10. Nano-scratch SEM morphology and local amplification

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图 11 划擦阶段的SEM形貌与仿真云图

Figure 11. SEM morphology and simulation nephogram during scratching stage

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图 12 耕犁阶段的SEM形貌与仿真云图

Figure 12. SEM morphology and simulation nephogram of ploughing stage

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图 13 切削阶段的SEM形貌与仿真云图

Figure 13. SEM morphology and simulation nephogram during cutting stage

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图 14 复合材料的去除形式

Figure 14. Removal forms of composite materials

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图 15 SiCp/Al变载荷划痕表面的形貌与划痕深度

Figure 15. Morphology and scratch depth of SiCp/Al scratch surface under variable load

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表 1 工件与压头材料属性

Table 1. Material properties of workpiece and indenter

参数	复合材料		金刚石压头
参数	Al	SiC	金刚石压头
密度 ρ / (t·mm⁻³)	2.70 × 10⁻⁹	3.13 × 10⁻⁹	4.25 × 10⁻⁹
杨氏模量 E / MPa	70 000	420 000	1 147 000
泊松比 ν	0.30	0.14	0.07

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表 2 SiCp/Al复合材料的微观力学性能参数

Table 2. Micromechanical properties parameters of SiCp/Al composite materials

力学性能参数		SiC颗粒	两相界面	基体相
硬度 H / GPa	范围	20.14～26.24	4.22～5.01	1.15～1.69
硬度 H / GPa	平均值	22.75	4.62	1.39
弹性模量 E₁ / GPa	范围	150.50～224.23	76.35～88.60	60.69～77.12
弹性模量 E₁ / GPa	平均值	190.78	84.38	66.52

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表 3 Al基体相J-C本构模型参数

Table 3. J-C constitutive model parameters of Al matrix phase

参数	取值
A / MPa	270
B / MPa	134
C	0.008 2
m	0.703
n	0.514
T_melt / ℃	600
T_room / ℃	20
${\bar \varepsilon ^{{\mathrm{pl}}}}/ {\mathrm{S}}^{-1}$	0.001

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表 4 Al基体相的J-C损伤参数

Table 4. J-C damage parameters of Al matrix phase

参数	取值
D₁	0.13
D₂	0.13
D₃	−1.551
D₄	0.011
D₅	0

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表 5 SiC颗粒脆性断裂的本构模型参数

Table 5. Constitutive model parameters for brittle fracture of SiC particles

参数	取值
$ {\sigma _{\mathrm{b}}} $/ MPa	1 500
$ G_{\mathrm{f}}^{\mathrm{I}} $/ (J·m⁻²)	30
$ p $	1
$ {\varepsilon _{\max }^{{\mathrm{ck}}}} $	0.001

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