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金刚石基材料及其表面微通道制备技术在高效散热中的应用

邓世博 夏永琪 吴明涛 岳晓斌 雷大江

邓世博, 夏永琪, 吴明涛, 岳晓斌, 雷大江. 金刚石基材料及其表面微通道制备技术在高效散热中的应用[J]. 金刚石与磨料磨具工程, 2024, 44(3): 286-296. doi: 10.13394/j.cnki.jgszz.2023.0132
引用本文: 邓世博, 夏永琪, 吴明涛, 岳晓斌, 雷大江. 金刚石基材料及其表面微通道制备技术在高效散热中的应用[J]. 金刚石与磨料磨具工程, 2024, 44(3): 286-296. doi: 10.13394/j.cnki.jgszz.2023.0132
DENG Shibo, XIA Yongqi, WU Mingtao, YUE Xiaobin, LEI Dajiang. Application of diamond based materials and surface microchannel fabricationtechnology in efficient heat dissipation[J]. Diamond & Abrasives Engineering, 2024, 44(3): 286-296. doi: 10.13394/j.cnki.jgszz.2023.0132
Citation: DENG Shibo, XIA Yongqi, WU Mingtao, YUE Xiaobin, LEI Dajiang. Application of diamond based materials and surface microchannel fabricationtechnology in efficient heat dissipation[J]. Diamond & Abrasives Engineering, 2024, 44(3): 286-296. doi: 10.13394/j.cnki.jgszz.2023.0132

金刚石基材料及其表面微通道制备技术在高效散热中的应用

doi: 10.13394/j.cnki.jgszz.2023.0132
基金项目: 国家自然科学基金(52005461); 河南省重大科技专项(221100230300)。
详细信息
    作者简介:

    邓世博,男,1999年生,硕士研究生。主要研究方向:精密加工及测量。E-mail:1047707038@qq.com

    通讯作者:

    雷大江,男,1974年生,硕士、研究员。主要研究方向:超精密加工。E-mail:leidajiang@163.com

  • 中图分类号: TG58; TQ164; TB131

Application of diamond based materials and surface microchannel fabricationtechnology in efficient heat dissipation

  • 摘要: 随着第三代半导体材料的兴起,电子器件逐渐向着高功率、小型化、集成化方向发展。传统散热技术已难以满足第三代半导体器件高热流的散热要求,由此带来的温度堆积问题成为器件失效的主要原因。金刚石基材料具有优异的散热性能,基于此材料的高效散热技术有望解决高热流散热难题。总结了金刚石基材料的发展及其表面微通道制备的主要方法,综述了金刚石基材料在高效散热领域中的应用和未来的发展方向。金刚石基材料高效散热技术的发展及应用能够为高热流密度散热难题的解决提供技术支撑。

     

  • 图  1  飞秒激光加工出的微通道形貌[24]

    Figure  1.  Microchannel morphology fabricated by femtosecond laser processing[24]

    图  2  紫外纳秒激光加工的金刚石微通道表面与截面形貌[25]

    Figure  2.  Surface and cross section morphology of diamond microchannel fabricated by ultraviolet nanosecond laser processing

    图  3  水导激光加工及加工后微结构

    Figure  3.  Water-assisted laser processing and microstructure after processing

    图  4  具有大深宽比的金刚石光学器件SEM图[29]

    Figure  4.  SEM image of diamond gratings with large aspect ratio

    图  5  等离子体蚀刻加工后的微结构阵列

    Figure  5.  Microstructure array after plasma etching processing

    图  6  铜模板内沉积的三维金刚石膜[36]

    Figure  6.  3D diamond film deposited on copper template

    图  7  模型复制法制得的微结构

    Figure  7.  Microstructure obtained by model replication technique

    图  8  金刚石微通道及表面亲水处理原理

    Figure  8.  Diamond microchannel and surface treatment for hydrophily

    图  9  金刚石微通道的转变机理示意[39]

    Figure  9.  Schematic diagram of the change mechanism of diamond microchannel

    图  10  铜质多孔表面金刚石微通道制造原理及实物图[23]

    Figure  10.  Manufacturing process and physical image of diamond microchannel with copper porous surface[23]

    图  11  基于金刚石-铜复合材料的扰流柱微通道结构[41]

    Figure  11.  Microchannel with pin fin based on diamond-copper composite material[41]

    图  12  3种不同材料热沉的实物图[42]

    Figure  12.  Images of three types of heat sinks of different materials [42]

    图  13  LDED增材制造金刚石-铜复合材料微通道示意图[43]

    Figure  13.  Schematic diagram of the LDED additive manufacturing for diamond-copper composite microchannel[43]

    图  14  金刚石热扩散层仿真

    Figure  14.  Simulation of diamond heat spreader

    图  15  金刚石热扩散层与液冷散热相结合

    Figure  15.  Combination of diamond heat spreader and liquid cooling heat dissipation

    表  1  常用散热材料的部分性能指标[1217]

    Table  1.   Properties of commonly used heat dissipation materials[1217]

    材料热膨胀系数/
    (10−6·K−1)
    热导率/
    (W·m−1·K−1)
    密度/
    (g·cm−3)
    热导率/密度
    (λ/ρ)
    Al23.02302.785.2
    Cu17.04008.944.9
    Mo5.014010.213.7
    Kovar5.9178.32.0
    Invar1.6108.11.2
    Diamond1.0~1.7800~2 2003.5227.3~625.0
    Diamond/Al7.0~9.01 0213.0340.3
    Diamond/Cu4.0~7.09005.0~6.0150.0~180.0
    下载: 导出CSV

    表  2  金刚石材料微通道的研究情况

    Table  2.   Recent research on the diamond microchannels

    材料散热能力结论文献来源
    多晶金刚石1 280 W/cm2热流金刚石微通道高效散热并有效提高热源温度均匀性[23]
    多晶金刚石267 W/cm2热流金刚石能有效扩散热源中心热量[19]
    金刚石600 W/cm2热流占空比是影响金刚石微通道传热性能的主要因素[40]
    多晶金刚石≥1 kW/cm2热流金刚石微通道在不同热流密度下,存在一个最佳入口质量流量[22]
    多晶金刚石5 637.10~11 447.20 W/(m2·K)传热系数金刚石微通道的传热系数较同条件下铝质微通道的提高37%~73%[21]
    多晶金刚石11 917 W/(m2·K)传热系数亲水性金刚石微通道传热性能提升20%~50%[38]
    硅 + 金刚石热点区域1 600 W/cm2热流热点区域温度均匀性提升41.7%[20]
    下载: 导出CSV

    表  3  针对金刚石热扩散层与微通道液冷散热相结合的研究情况

    Table  3.   Recent research on the combination of diamond heat spreader and microchannel liquid cooling

    热沉材料 金刚石厚度/μm 散热能力 kW/cm2 文献来源
    SiC 400 热流4~5 [49]
    300 热流2.38~11.90 [47]
    400 热流~10 [48]
    150 稳态热流1
    峰值热流30
    [50]
    铜钼合金 0~20 峰值热流4.3 [44]
    铜钼合金 0~14 峰值热流18 [45]
    Si/SiC/金刚石 0~10 热流0.86~3.01 [46]
    下载: 导出CSV
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出版历程
  • 收稿日期:  2023-06-21
  • 修回日期:  2023-10-08
  • 录用日期:  2023-11-03
  • 网络出版日期:  2023-11-06
  • 刊出日期:  2024-06-28

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