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金刚石粒径对金刚石/Cu-B合金复合材料热物理性能的影响

王熹 康翱龙 焦增凯 康惠元 吴成元 周科朝 马莉 邓泽军 王一佳 余志明 魏秋平

王熹, 康翱龙, 焦增凯, 康惠元, 吴成元, 周科朝, 马莉, 邓泽军, 王一佳, 余志明, 魏秋平. 金刚石粒径对金刚石/Cu-B合金复合材料热物理性能的影响[J]. 金刚石与磨料磨具工程, 2024, 44(2): 169-178. doi: 10.13394/j.cnki.jgszz.2023.0062
引用本文: 王熹, 康翱龙, 焦增凯, 康惠元, 吴成元, 周科朝, 马莉, 邓泽军, 王一佳, 余志明, 魏秋平. 金刚石粒径对金刚石/Cu-B合金复合材料热物理性能的影响[J]. 金刚石与磨料磨具工程, 2024, 44(2): 169-178. doi: 10.13394/j.cnki.jgszz.2023.0062
WANG Xi, KANG Aolong, JIAO Zengkai, KANG Huiyuan, WU Chengyuan, ZHOU Kechao, MA Li, DENG Zejun, WANG Yijia, YU Zhiming, WEI Qiuping. Effect of diamond particle size on thermophysical properties of diamond /Cu-B alloy composites[J]. Diamond & Abrasives Engineering, 2024, 44(2): 169-178. doi: 10.13394/j.cnki.jgszz.2023.0062
Citation: WANG Xi, KANG Aolong, JIAO Zengkai, KANG Huiyuan, WU Chengyuan, ZHOU Kechao, MA Li, DENG Zejun, WANG Yijia, YU Zhiming, WEI Qiuping. Effect of diamond particle size on thermophysical properties of diamond /Cu-B alloy composites[J]. Diamond & Abrasives Engineering, 2024, 44(2): 169-178. doi: 10.13394/j.cnki.jgszz.2023.0062

金刚石粒径对金刚石/Cu-B合金复合材料热物理性能的影响

doi: 10.13394/j.cnki.jgszz.2023.0062
基金项目: 国家“十四五”重点研究发展计划(2021YFB3701800);国家自然科学基金(52071345,51874370,51601226);广东省“十三五”重点研究开发项目(2020B01085001);湖南省高新技术产业科技创新引领计划(2022GK4037,2022GK4047);湖南省教育厅资助科研项目(20C0037)。
详细信息
    通讯作者:

    魏秋平,男,1980年生,教授。主要研究方向:功能薄膜材料与表面改性技术。E-mail: qiupwei@csu.edu.cn

  • 中图分类号: TQ164; TG74

Effect of diamond particle size on thermophysical properties of diamond /Cu-B alloy composites

  • 摘要: 采用Cu-B合金为基体,选用粒径分别为110、230、550 μm的金刚石颗粒作为增强体,利用气压熔渗工艺在1 100 ℃、10 MPa气体压力下制备金刚石/Cu-B合金复合材料,研究金刚石颗粒粒径对复合材料组织结构、界面相分布及热物理性能的影响。结果表明,随着金刚石粒径的增大,复合材料热导率上升,热膨胀系数减小,复合材料界面处硼碳化合物含量增加,界面结合情况得到改善。由金刚石颗粒粒径为550 μm时,复合材料热导率最高,可达680.3 W/(m·K) ,热膨胀系数最小,为4.905 × 10−6 K−1,符合高效热管理器件对金刚石/金属基复合材料的热物理性能要求,在电子产品散热器件方面具有良好的应用前景。

     

  • 图  1  不同粒径金刚石/Cu-B合金复合材料XRD和Raman表征

    Figure  1.  XRD and Raman spectra of diamond/copper-boron alloy composite with different particle sizes

    Raman spectra

    图  2  不同粒径金刚石/Cu-B合金复合材料界面结合情况:样品S550 (a) 低倍形貌 (b) 中倍形貌 (c) 高倍形貌; 样品S230 (d) 低倍形貌 (e) 中倍形貌 (f) 高倍形貌;样品S110 (g) 低倍形貌 (h) 中倍形貌 (i) 高倍形貌

    Figure  2.  Surface morphologies of diamond/Cu-B alloy composites: (a) Low magnification morphology (b) Middle magnification morphology (c) High magnification morphology of sample S550, (d) Low magnification morphology (e) Middle magnification morphology (f) High magnification morphology of sample S230, (g) Low magnification morphology (h) Middle magnification morphology (i) High magnification morphology of sample S110

    图  3  电化学腐蚀后不同粒径金刚石/Cu-B合金复合材料表面形貌

    (a) 样品S550低倍形貌; (b) 样品S550中倍形貌; (c) 样品S550高倍形貌; (d)样品S230低倍形貌; (e) 样品S230中倍形貌; (f)样品S230高倍形貌; (g) 样品S110低倍形貌; (h)样品S110 中倍形貌; (i) 样品S110高倍形貌

    Figure  3.  Surface morphologies of diamond / copper boron alloy composites with different particle sizes after electrochemical corrosion

    (a) Low magnification morphology;(b) Middle magnification morphology; (c) High magnification morphology of sample S550;(d) Low magnification morphology; (e) Middle magnification morphology ;(f) High magnification morphology of sample S230;(g) Low magnification morphology; (h) Middle magnification morphology; (i) High magnification morphology of sample S110

    图  4  电化学腐蚀后不同粒径金刚石/Cu-B合金微观形貌及EDS能谱图

    (a) 样品S230;(b) 样品S110

    Figure  4.  Microstructure and EDS spectra of diamond / copper boron alloy with different particle sizes after electrochemical corrosion

    Sample S230;Sample S110

    图  5  不同粒径的金刚石/Cu-B合金复合材料热导率

    Figure  5.  Thermal conductivity of diamond / copper boron alloy composites with different particle sizes

    图  6  Cu-B合金及不同粒径样品的红外热成像

    Figure  6.  Infrared thermography of copper-boron alloy and samples with different particle sizes

    图  7  Cu-B合金及不同粒径样品表面的时间-温度关系曲线

    Figure  7.  Surface temperature versus time curves of different samples and copper-boron

    图  8  不同粒径金刚石/Cu-B合金复合材料热膨胀系数

    Figure  8.  Thermal expansion coefficient of diamond / copper boron alloy composites with different particle sizes

    表  1  不同粒径复合材料的密度、致密度、金刚石体积分数、比热容及热扩散系数

    Table  1.   Density, densification, diamond volume fraction and thermal diffusivity of diamond/copper-boron alloy composites

    样品 密度
    $\rho $/(g·cm−3
    金刚石体积
    分数 V/%
    致密度
    $ \rho_2 $/%
    比热容
    c /(J·g−1·K−1
    热扩散系数
    $\alpha $/(mm2·s−1
    S550 5.61 53.2 95.24 0.43 283.11
    S230 5.37 54.1 94.91 0.44 265.04
    S110 5.87 52.2 91.28 0.42 132.00
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  • 收稿日期:  2023-03-14
  • 修回日期:  2023-06-30
  • 录用日期:  2023-07-18
  • 刊出日期:  2024-04-01

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