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用于金刚石摩擦化学抛光的Ni-W合金盘制备

牛昊 金洙吉 沈煜 杨辉鹏

牛昊, 金洙吉, 沈煜, 杨辉鹏. 用于金刚石摩擦化学抛光的Ni-W合金盘制备[J]. 金刚石与磨料磨具工程, 2024, 44(1): 39-49. doi: 10.13394/j.cnki.jgszz.2023.0042
引用本文: 牛昊, 金洙吉, 沈煜, 杨辉鹏. 用于金刚石摩擦化学抛光的Ni-W合金盘制备[J]. 金刚石与磨料磨具工程, 2024, 44(1): 39-49. doi: 10.13394/j.cnki.jgszz.2023.0042
NIU Hao, JIN Zhuji, SHEN Yu, YANG Huipeng. Preparation of Ni-W alloy disc for dynamic friction polishing of diamond[J]. Diamond & Abrasives Engineering, 2024, 44(1): 39-49. doi: 10.13394/j.cnki.jgszz.2023.0042
Citation: NIU Hao, JIN Zhuji, SHEN Yu, YANG Huipeng. Preparation of Ni-W alloy disc for dynamic friction polishing of diamond[J]. Diamond & Abrasives Engineering, 2024, 44(1): 39-49. doi: 10.13394/j.cnki.jgszz.2023.0042

用于金刚石摩擦化学抛光的Ni-W合金盘制备

doi: 10.13394/j.cnki.jgszz.2023.0042
详细信息
    通讯作者:

    金洙吉,男,教授、博士生导师、硕士生导师。主要研究方向:精密与超精密加工技术、特种加工及其控制技术、难加工材料高效加工技术。Email: kimsg@dlut.edu.cn

  • 中图分类号: TQ164;TG58;TQ153.2

Preparation of Ni-W alloy disc for dynamic friction polishing of diamond

  • 摘要: 为探究镀液成分、工艺条件等因素对Ni-W合金镀层的影响,制备出低内应力、高硬度的Ni-W合金盘,用于金刚石的摩擦化学抛光。采用单一性实验分别探究络合剂浓度、溶液pH、糖精钠浓度对镀层内应力、钨含量、硬度以及沉积速率的影响,并探究不同添加剂对镀层表面整平的效果。最终选用水杨醛为整平剂,并采用反向脉冲电流降低了镀层表面粗糙度,制备出硬度达HV 713,镀层厚度约为0.66 mm的Ni-W合金盘。使用合金盘对金刚石进行摩擦化学抛光,并探究合适的抛光工艺参数。在合金盘转速为8000 r/min,压力为40 N时,金刚石的抛光效果较好,其材料去除率为5.56 μm/min,磨削比达0.394,金刚石表面粗糙度Sa为3.7 nm。使用传统铸铁盘对金刚石进行摩擦化学抛光,通过对比磨损参数发现,Ni-W合金盘能够达到更好的抛光效果。

     

  • 图  1  摩擦化学抛光金刚石原理图

    Figure  1.  Schematic diagram of dynamic friction polishing diamond

    图  2  镀液pH值的影响

    Figure  2.  Effects of bath pH values

    图  3  络合剂加入量的影响

    Figure  3.  Influences of complexing agent content

    图  4  不同柠檬酸三钠浓度下镀层的显微形貌

    Figure  4.  Micromorphologies of coatings at different concentrations of trisodium citrate

    图  5  糖精钠浓度的影响

    Figure  5.  Effect of saccharin sodium concentration

    图  6  抛光盘表面形貌

    Figure  6.  Surface morphology of polishing disc

    图  7  使用不同添加剂后抛光盘的表面形貌

    Figure  7.  Surface morphologies of polishing discs with different additives

    图  8  添加水杨醛的电镀盘镀层侧面形貌

    Figure  8.  Side morphology of coating with salicylaldehyde added

    图  9  电镀盘抛光压力的影响

    Figure  9.  Influences of polishing pressures on electroplating plate

    图  10  电镀盘抛光转速的影响

    Figure  10.  Influences of polishing speeds of electroplating plate

    图  11  金刚石抛光后的表面形貌

    Figure  11.  Surface morphologies of polished diamond

    图  12  铸铁盘抛光压力的影响

    Figure  12.  Effects of polishing pressures on cast iron disc

    图  13  铸铁盘抛光转速的影响

    Figure  13.  Influences of polishing speeds of cast iron disc

    图  14  金刚石抛光后的表面粗糙度

    Figure  14.  Surface roughness after diamond polishing

    表  1  初始镀液配方

    Table  1.   Initial bath formula

    成分化学名称浓度ρ /(g·L−1
    主盐A二水合硫酸镍40.00
    主盐B六水合钨酸钠40.00
    络合剂柠檬酸三钠80.00
    缓冲剂硼酸35.00
    导电盐溴化钠10.00
    表面活性剂十二烷基硫酸钠0.15
    下载: 导出CSV

    表  2  实验设备

    Table  2.   Experimental equipment

    设备名称用途
    QUANTA 450扫描电子显微镜观察Ni-W合金镀层的微观形貌
    Oxford X-Max型EDS测量镀层的元素组分
    MVS-1000Z维氏硬度计测量镀层的显微硬度
    VHX-600E超景深显微镜观察金刚石表面形貌
    3D表面光学轮廓Zygo9000测量金刚石表面粗糙度
    DV215CD精密天平称量镀件质量
    XP6梅特勒电子天平称量金刚石质量
    下载: 导出CSV

    表  3  金刚石的磨削参数对比

    Table  3.   Comparison of grinding parameters of diamond

    参数铸铁盘电镀盘
    金刚石去除率 Rdia / (μm·min−1)0.455.56
    抛光盘磨损率 Rd / (mm³·min−1)0.450.13
    磨削比 R20.0130.394
    表面粗糙度 Sa / nm22.83.7
    下载: 导出CSV
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出版历程
  • 收稿日期:  2023-02-27
  • 修回日期:  2023-04-04
  • 录用日期:  2023-04-13
  • 网络出版日期:  2023-11-06
  • 刊出日期:  2024-02-20

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