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磁流变变间隙动压平坦化加工的工艺及机理

阎秋生 蔡志航 潘继生 黄蓓 曾自勤

阎秋生, 蔡志航, 潘继生, 黄蓓, 曾自勤. 磁流变变间隙动压平坦化加工的工艺及机理[J]. 金刚石与磨料磨具工程, 2022, 42(4): 488-494. doi: 10.13394/j.cnki.jgszz.2022.0004
引用本文: 阎秋生, 蔡志航, 潘继生, 黄蓓, 曾自勤. 磁流变变间隙动压平坦化加工的工艺及机理[J]. 金刚石与磨料磨具工程, 2022, 42(4): 488-494. doi: 10.13394/j.cnki.jgszz.2022.0004
YAN Qiusheng, CAI Zhihang, PAN Jisheng, HUANG Bei, ZENG Ziqin. Process and mechanism of magnetorheological variable gap dynamic pressure planarization finishing[J]. Diamond & Abrasives Engineering, 2022, 42(4): 488-494. doi: 10.13394/j.cnki.jgszz.2022.0004
Citation: YAN Qiusheng, CAI Zhihang, PAN Jisheng, HUANG Bei, ZENG Ziqin. Process and mechanism of magnetorheological variable gap dynamic pressure planarization finishing[J]. Diamond & Abrasives Engineering, 2022, 42(4): 488-494. doi: 10.13394/j.cnki.jgszz.2022.0004

磁流变变间隙动压平坦化加工的工艺及机理

doi: 10.13394/j.cnki.jgszz.2022.0004
基金项目: 国家自然科学基金(U1801259);广州市科技计划(201904010300);广东省自然科学基金(2019A1515010720)。
详细信息
    通讯作者:

    阎秋生,男,1962 年生,博士、教授、博士生导师。主要研究方向:光电子/微电子硬脆材料超精密加工理论与技术、材料节能节材加工技术等。E-mail:qsyan@gdut.edu.cn

  • 中图分类号: TG58;TH161

Process and mechanism of magnetorheological variable gap dynamic pressure planarization finishing

  • 摘要: 为提高光电晶片的磁流变抛光效率并实现其超光滑平坦化加工,提出其磁流变变间隙动压平坦化加工方法,研究不同变间隙条件下蓝宝石晶片的材料去除率和表面粗糙度随加工时间的变化,并分析磁流变变间隙动压平坦化加工机理。结果表明:通过蓝宝石晶片对磁流变抛光液施加轴向低频挤压振动,其抛光压力动态变化且磁流变液产生挤压强化效应,使抛光效率与抛光效果显著提升。在工件下压速度为1.0 mm/s,拉升速度为3.5 mm/s,挤压振动幅值为1 mm条件下磁流变变间隙动压平坦化抛光120 min后,蓝宝石晶片的表面粗糙度Ra由 6.22 nm下降为0.31 nm,材料去除率为5.52 nm/min,相较于恒定间隙磁流变抛光,其表面粗糙度降低66%,材料去除率提高55%。改变变间隙运动速度可以调控磁流变液的流场特性,且合适的工件下压速度和工件拉升速度有利于提高工件的抛光效率和表面质量。

     

  • 图  1  磁流变变间隙动压平坦化加工原理图

    Figure  1.  Schematic diagram of magnetorheological variable gap dynamic pressure planarization finishing

    图  2  磁流变变间隙动压平坦化加工试验装置

    Figure  2.  Magnetorheological variable gap dynamic pressure planarization finishing experimental device

    图  3  材料去除率随加工时间的变化

    Figure  3.  Change of material removal rate with processing time

    图  4  加工表面粗糙度与加工时间的关系

    Figure  4.  Relationship between machining surface roughness and machining time

    图  5  蓝宝石表面形貌随加工时间的变化

    Figure  5.  Variation of sapphire surface morphologies with processing times

    图  6  不同加工条件下的抛光效果对比分析

    Figure  6.  Comparative analysis of polishing effects under different processing conditions

    图  7  蓝宝石晶片不同位置的表面粗糙度

    Figure  7.  Surface roughness of sapphire wafer at different positions

    图  8  磁流变变间隙动压平坦化加工作用机理

    Figure  8.  Mechanism of magnetorheological variable gap dynamic pressure flattening

    表  1  试验工艺参数表

    Table  1.   Experimental process parameters

    试验
    编号
    挤压振动
    幅值
    A / mm
    下压速度
    v1 / (mm·s−1)
    拉升速度
    v2 / (mm·s−1)
    加工时间
    t / min
    100015, 30, 60, 90, 120
    211.01.0
    311.03.5
    413.53.5
    下载: 导出CSV
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出版历程
  • 收稿日期:  2022-01-28
  • 修回日期:  2022-03-21
  • 录用日期:  2022-03-21
  • 网络出版日期:  2023-02-07
  • 刊出日期:  2022-08-10

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