Grinding performance of micro-texured grinding wheel on different ceramic materials
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摘要: 基于阵列微孔的微结构砂轮和普通砂轮对氧化铝、氮化铝、氧化锆及氮化硅陶瓷材料的不同磨削性能，对比研究不同砂轮和不同陶瓷材料的磨削力、比磨削能、表面粗糙度及表面崩边特征。结果表明：相比普通砂轮，微结构砂轮提高了氧化铝、氮化铝及氧化锆陶瓷的磨削力和比磨削能，降低了表面粗糙度，而对氮化硅陶瓷的磨削力及表面粗糙度影响不明显；相比其他陶瓷，氮化硅陶瓷具有较高的磨削力和比磨削能。从磨削加工表面特征上看，氧化铝、氮化铝陶瓷以脆性去除方式为主，氧化锆以塑性去除为主，而氮化硅则兼具塑性和脆性去除特征；微结构砂轮加工表面崩边尺寸大于普通砂轮的崩边尺寸，氧化铝和氮化铝陶瓷的表面崩边尺寸明显大于氧化锆和氮化硅陶瓷的。Abstract: The grinding performance of micro-textured grinding wheel with arrayed micro-hole and common grinding wheel are compared through experiments on alumina, aluminum nitride, zirconia and silicon nitride ceramic materials. The grinding force, the specific grinding energy, the surface roughness and the surface chipping are analyzed. In comparison with common grinding wheel, micro-textured grinding wheel improves the grinding force and the specific grinding energy in grinding of alumina, aluminum nitride and zirconia ceramics, reduces the surface roughness of these ceramics, but has a little effect on the grinding force and the surface roughness of silicon nitride ceramics. Silicon nitride has higher grinding force and specific grinding energy than other ceramic materials do. The surface characteristics of alumina and aluminum nitride mainly imply brittle removal mode, while a ductile removal mode is characterized on the surface of zirconia and silicon nitride has both plastic and brittle removal characteristics. The surface chipping thickness processed by the micro-textured grinding wheel is larger than that of the common grinding wheel, while the surface chipping thickness of both alumina and aluminum nitride ceramics is larger than those of zirconia and silicon nitride ceramics.
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图 1 磨削加工示意图
(a)磨床设备；(b)微结构砂轮；(c)表面崩边尺寸测量
Figure 1. Grinding schematic diagram
(a) Grinding equipment; (b) Micro-textured grinding wheel; (c) Surface chipping thickness measurement
图 4 不同陶瓷材料的
$\left( {K_{{\rm{IC}}}^{1/2}H} \right)/{E^{2/5}}$ 值Figure 4.
$\left( {K_{{\rm{IC}}}^{1/2}H} \right)/{E^{2/5}}$ value of different ceramic materials
图 5 比磨削能随
$ {\mathit{h}}_{\rm{m}} $ 的变化Figure 5. Change of specific grinding energy with
$ {\mathit{h}}_{\rm{m}} $ 
图 8 微结构砂轮降低ZrO2表面粗糙度的原理示意图
Figure 8. schematic diagram of micro-textured grinding wheel for reducing the surface roughness of ZrO2
图 9 不同陶瓷材料的崩边尺寸Ct以及临界切深dc的关系
Figure 9. Relationship between chipping thickness Ct and critical cutting depth dc
of different ceramic materials ( vs=10.47 m/s, vw=7.5 m/min, ap=10 μm)
图 10 不同陶瓷材料的表面崩边形貌与尺寸
Figure 10. Morphology and thickness of the surface chipping on different ceramic materials
表 1 陶瓷材料的理化性能及用途
Table 1. Physical and chemical properties of ceramic materials and their applications
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表 2 陶瓷材料的力学性能
Table 2. Mechanical properties of ceramic materials
陶瓷 硬度 H / GPa 弹性模量 E / GPa 断裂韧性 KIC / (MPa·m1/2) Al2O3 16.1 422 3.9 AlN 9.8 342 3.0 Si3N4 14.7 268 7.0 ZrO2 13.5 257 8.0
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表 3 磨削实验参数
Table 3. Grinding parameters
参数类型 取值 砂轮线速度vs / (m·s−1) 10.47 进给速度vw / (m·min−1) 5.0，7.5，10.0，12.5 磨削深度ap / μm 5，10，15，20
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