金属结合剂金刚石砂轮表面微槽的激光修整技术

郭泫洋; 徐钰淳; 曹剑锋; 朱建辉; 赵延军; 赵金伟; 师超钰

doi:10.13394/j.cnki.jgszz.2021.3006

金属结合剂金刚石砂轮表面微槽的激光修整技术

doi: 10.13394/j.cnki.jgszz.2021.3006

郭泫洋^{1, 2,},
徐钰淳^{1, 2},
曹剑锋²,
朱建辉^{1, 2},
赵延军^{1, 2},
赵金伟²,
师超钰^{1, 2}

1.
超硬材料磨具国家重点实验室, 郑州 450001
2.
郑州磨料磨具磨削研究所有限公司, 郑州 450001

详细信息

作者简介:
郭泫洋，男，1991年生，工程师。主要研究方向：精密磨削技术。E-mail: xuanyang-guo@foxmail.com

中图分类号: TQ164; TG74; TG58
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出版历程
- 收稿日期: 2021-04-06
- 修回日期: 2022-03-04
- 刊出日期: 2022-07-13

Laser dressing technology for micro-grooves on the surface of metal-bonded diamond wheels

GUO Xuanyang^{1, 2
,},
XU Yuchun^{1, 2},
CAO Jianfeng²,
ZHU Jianhui^{1, 2},
ZHAO Yanjun^{1, 2},
ZHAO Jinwei²,
SHI Chaoyu^{1, 2}

1.
State Key Laboratory of Superabrasives, Zhengzhou 450001, China
2.
Zhengzhou Research Institute for Abrasives & Grinding Co., Ltd., Zhengzhou 450001, China

摘要

摘要: 针对金属结合剂金刚石砂轮表面微槽修整困难的问题，采用红外纳秒激光器开展修整试验，探究激光功率、脉冲重复频率、激光烧蚀时间等因素对其材料去除的影响规律，并对U型和V型2种砂轮微槽提出梯度步进激光修整工艺。结果表明：修整后的砂轮微槽实际轮廓与设计轮廓对比，其顶部和底部实际宽度相对误差的绝对值最大为4.4%，实际深度相对误差的绝对值最大为9.6%。用修整后的砂轮V型微槽对直径为4英寸(10.16 cm)的蓝宝石晶圆边缘进行倒角，晶圆锐利的边缘被修整成规则形状，边缘轮廓对称度良好，且与激光修整后砂轮表面的微槽轮廓一致，验证了金属结合剂金刚石砂轮表面微槽激光成型修整的可行性。
- 激光加工 /
- 金属结合剂金刚石砂轮 /
- 微槽修整 /
- 晶圆边缘磨削
Abstract: In order to solve the difficult problem of dressing micro-grooves on the surface of metal-bonded diamond wheel, an infrared nanosecond laser was used to carry out the dressing test. The influences of laser average power, pulse repetition frequency, laser ablation time and other factors on the material removal of metal-bonded diamond grinding wheel was investigated. A gradient step laser dressing process was proposed for U-shaped and V-shaped grinding wheel micro-grooves. The results show that the actual contour of the grinding wheel micro-groove after dressing is compared with the designed contour, the maximum absolute value of the relative error of the actual width at the top and bottom is 4.4%, and the maximum absolute value of the relative error of the actual depth is 9.6%. The edge of the sapphire wafer with a diameter of 4 inches (10.16 cm) is chamfered with the V-shaped micro-groove of the trimmed grinding wheel. The sharp edge of the wafer is trimmed into a regular shape, and the symmetry of the edge contour is good, which is consistent with the micro-groove contour of the surface of the laser trimmed grinding wheel. The feasibility of laser shaping and dressing of the micro-groove on the surface of metal-bonded diamond grinding wheel is verified.
- laser processing /
- metal-bonded diamond wheel /
- micro-groove dressing /
- wafer edge grinding

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图 1 激光光斑运动轨迹

Figure 1. Laser spot trajectory

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图 2 光斑重叠示意图

Figure 2. Schematic diagram of spot overlap

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图 3 激光修整方法示意图

Figure 3. Schematic diagram of laser dressing method

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图 4 微槽深度随激光平均功率变化的趋势

Figure 4. Variation trend of micro-groove depths with average laser powers

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图 5 不同平均功率下的槽深梯度变化

Figure 5. Variation of groove depth gradient under different average power

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图 6 不同平均功率下槽深随烧蚀时间的变化

Figure 6. Variation of micro-groove depths with ablation times under different average powers

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图 7 不同烧蚀时间下的微槽形貌

Figure 7. Micro-groove morphology under different ablation time

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图 8 微槽深度随脉冲重复频率变化的趋势

Figure 8. Trend of micro-groove depths with pulse repetition frequencies

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图 10 2种微槽尺寸

Figure 10. Two micro-groove sizes

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图 11 梯形步进修整示意图

Figure 11. Schematic diagram of trapezoidal stepping dressing

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图 12 微槽检测结果

Figure 12. Micro-groove detection results

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图 13 U型微槽轮廓的阶梯式变化

Figure 13. Stepped change of U-shaped micro-groove profile

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图 14 V型微槽轮廓

Figure 14. V-shaped micro-groove profile

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图 15 蓝宝石晶圆的边缘截面图

Figure 15. Edge cross-section of sapphire wafer

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表 1 激光修整试验参数

Table 1. Parameters of laser dressing test

脉冲重复频率 f / kHz	20～200
激光平均功率 P / W	20～50
激光扫描速度 v_l / (mm·s⁻¹)	750
砂轮线速度 v_f / (mm·s⁻¹)	11
烧蚀时间 t / min	1～5
烧蚀线宽 l / μm	300

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表 2 2种砂轮槽型修整方案

Table 2. Dressing schemes of two grinding wheel grooves

烧蚀步数	U型槽		V型槽
烧蚀步数	烧蚀线宽 l / μm	烧蚀时间 t / min	烧蚀线宽 l / μm	烧蚀时间 t / min
1	600	1	300	1
2	450	1	200	1
3	300	1	100	1

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表 3 实际修整槽尺寸及相对误差

Table 3. Dimension and relative error of actual dressing groove

槽型	槽编号	顶部设计槽宽 L₁ / μm	顶部实际槽宽 L₂ / μm	相对误差 δ₁ / %	底部设计槽宽 L₃ / μm	底部实际槽宽 L₄ / μm	相对误差 δ₂ / %	设计槽深 h₁ / μm	实际槽深 h₂ / μm	相对误差 δ₃ / %
U型槽	U1	650	635	−2.3	380	373	−1.8	250	234	−6.4
	U2		640	−1.5		369	−2.9		230	−8.0
	U3		640	−1.5		375	−1.3		235	−6.0
	U4		655	0.8		377	−0.8		230	−8.0
V型槽	V1	350	335	−4.3	180	182	1.1		261	4.4
	V2		335	−4.3		176	−2.2		274	9.6
	V3		345	−1.5		185	2.8		239	−4.4
	V4		345	−1.5		172	−4.4		249	−0.4

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表 4 蓝宝石及设备工艺参数

Table 4. Sapphire and equipment process parameters

参数	类型或取值
4英寸晶圆直径 D / cm	10.16
晶圆厚度 H / μm	300
晶圆晶向	C（0001）面
倒角设备	东京精密晶圆倒角机床W−GM
主轴转速 n / ( r·min⁻¹)	2 000
吸盘转速 v / (mm·s⁻¹)	6
一次切入量 d₁ / μm	50

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